Izingxenye zamalambu e-LED: i-semiconductor material chip, iglue emhlophe, ibhodi lesifunda, i-epoxy resin, i-core wire, igobolondo.Isibani se-LED iyi-chip ye-electroluminescent semiconductor material, ephulukiswa kubakaki ngeglue esiliva noma iglue emhlophe, bese ixhuma i-chip nebhodi lesifunda ngocingo olusiliva noma ucingo lwegolide.Indawo ezungezile ivalwe nge-epoxy resin ukuvikela intambo engaphakathi engaphakathi.Umsebenzi, ekugcineni ufake igobolondo, ngakho isibani se-LED sinokusebenza okuhle kokuzamazama komhlaba.

I-LED light-emitting diode iyisisetshenziswa se-solid state semiconductor esingaguqula amandla kagesi abe ukukhanya okubonakalayo.Ingakwazi ukuguqula ngokuqondile ugesi ube ukukhanya.Inhliziyo ye-LED iyi-chip ye-semiconductor, umkhawulo owodwa we-chip unamathiselwe ekusekelweni, umkhawulo owodwa uyisigxobo esingalungile, kanti esinye isiphetho sixhunywe esigxotsheni esihle sokunikezwa kwamandla, ukuze yonke i-chip ihlanganiswe. nge-epoxy resin.

Umgomo wokukhipha ukukhanya kwezibani ze-LED

Lapho i-current idlula ku-wafer, ama-electron aku-semiconductor yohlobo lwe-N kanye nezimbobo ku-semiconductor yohlobo lwe-P ashayisana ngobudlova futhi aphinde ahlangane kusendlalelo esikhipha ukukhanya ukuze akhiqize ama-photon, akhipha amandla ngendlela yama-photons (okungukuthi. , ukukhanya okubonwa yiwo wonke umuntu).Ama-semiconductors ezinto ezahlukene azokhiqiza imibala ehlukene yokukhanya, njengokukhanya okubomvu, ukukhanya okuluhlaza, ukukhanya okuluhlaza okwesibhakabhaka nokunye.

Phakathi kwezingqimba ezimbili zama-semiconductors, ama-electron nezimbobo ziyashayisana futhi ziphinde zihlangane futhi zikhiqize ama-photon aluhlaza kungqimba olukhipha ukukhanya.Ingxenye yokukhanya okuluhlaza okwesibhakabhaka okukhiqiziwe izokhishwa ngokuqondile nge-fluorescent coating;ingxenye esele izoshaya i-fluorescent coating futhi ihlanganyele nayo ukuze ikhiqize ama-photon aphuzi.I-photon eluhlaza okwesibhakabhaka ne-photon ephuzi kusebenza ndawonye (kuxutshwe) ukuze kukhiqizwe ukukhanya okumhlophe