I-SMD isifinyezo se-Surface Mounted Device, ehlanganisa izinto ezifana nezinkomishi zamalambu, abakaki, ama-chips, i-lead, ne-epoxy resin ekucacisweni okuhlukene kobuhlalu besibani, bese yenza amamojula wokubonisa ama-LED ngokuwahlanganisa ebhodini le-PCB ngendlela amapheshana.

Izibonisi ze-SMD ngokuvamile zidinga ukuthi ubuhlalu be-LED buvezwe, okungabangeli kalula nje ukukhuluma phakathi kwamaphikseli, kodwa futhi kuphumele ekusebenzeni kabi kokuvikela, okuthinta ukusebenza kwesithombe nempilo yesevisi.

Umdwebo we-SMD microstructure

I-COB, efushanisiwe ngokuthi i-Chip On Board, ibhekisela kubuchwepheshe bokupakisha be-LED obuqinisa ngokuqondile ama-chip e-LED kumabhodi esekethe aphrintiwe (ama-PCB), esikhundleni sokudayisela amaphakheji e-LED anomumo ngamunye kuma-PCB.

Le ndlela yokupakisha inezinzuzo ezithile ekukhiqizeni nasekukhiqizeni, ikhwalithi yokuthwebula izithombe, ukuvikelwa, kanye nezinhlelo zokusebenza ezincane zokuhlukanisa isikhala.